Siltronic AG has existed in its current form since 2004, while tracing its business origins back to the start of research and development involving high-purity silicon in 1953.
1953 | Initial research and development in the high-purity silicon area |
1958 | Semiconductor production kicks off |
1959 | First float-zone facility operational at the new high-purity silicon plant |
1961 | High-purity silicon production facilities embark on industrial-scale production |
1962 | Development of the first silicon wafer |
1968 | Foundation of Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH (“Wacker-Chemitronic”) |
1978 | Foundation of Wacker Siltronic Corporation in Portland, Oregon (USA). |
1984 | First 200 mm wafers at Wacker-Chemitronic |
1990 | First research and development projects for 300 mm wafers |
1994/1995 | As sole shareholder, Wacker-Chemitronic establishes Wacker Siltronic Gesellschaft für Halbleitermaterialien mbH |
1995 | Acquisition of Freiberger Elektronikwerkstoffe Produktions- und Vertriebsgesellschaft mbH, Freiberg, which was merged into our company on January 8, 1996 |
1995 | Wacker-Chemitronic transfers its wafer business to Wacker Siltronic |
1996 | Wacker Siltronic Gesellschaft für Halbleitermaterialien mbH is converted into a stock corporation under the name of Wacker Siltronic Gesellschaft für Halbleitermaterialien AG |
1997 | Foundation of Wacker Siltronic Singapore Pte. Ltd. |
1998 | Initial operation of the first expansion stage of the 300 mm pilot production line in Burghausen |
1999 | Fab in Singapore kicks off production |
2002 | Company name changed to Wacker Siltronic AG |
2004 | 300 mm silicon wafer fab launches production in Freiberg |
2004 | Company name changed to Siltronic AG |
2006 | Foundation of joint venture Siltronic Samsung Wafer Pte. Ltd. (now: Siltronic Silicon Wafer Pte. Ltd.) with Samsung. Construction starts on 300 mm wafer fab in Singapore |
2008 | The first wafers from the joint venture in Singapore are shipped on January 30, 2008 |
2014 | Acquisition of majority share (78 percent) in Siltronic Silicon Wafer Pte. Ltd. in Singapore |
2015 | Siltronic executes successful IPO |
2017 | Wacker executes a second placement and holds a minority of 30,8 percent |
2021 | Start of construction of the new 300 mm fab at the Singapore site |
2023 | Production of the first 300 mm wafers at the new Singapore fab |
2024 | Inauguration of the new 300 mm fab in Singapore |