Flatness and surface quality are very crucial requirements of leading edge applications. Therefore, surface defects are removed in a chemical-mechanical polishing process. The result is an extremlely flat wafer with a mirror-like surface.

Siltronic offers various types of polished silicon wafer with diameters from 125 to 300 mm. Standard polished wafers are manufactured with standard CZ crystal technology. Depending on the customer’s needs, different kind of dopants are added: boron, phosphorus, red phosphorus, arsenic and antimony. Neutrondoped crystals, using radiation, are produced for special applications.