Argon-annealed wafers are primarily used for CMOS technology processes. The special manufacturing processes enable a defect optimzed surface.

To produce an argon-annealed wafer, specially engineered substrates are required. This is achieved through a special thermal process controlling the precipitation of the intrinsic oxygen in these wafers to meet denuded zone requirements.

Siltronic offers argon annealed wafers with diameters from 200 to 300 mm.