Whereas 200 mm Czochralski grown material is available since mid 80's, the technical limit in crystal pulling of FZ was seen at 150 mm for a long time. In 2002, Siltronic succeeded to pull 200 mm FZ ingots and to produce 200 mm FZ wafers as the first silicon manufacturer worldwide. Since this time, Siltronic has continued to ramp and now runs volume production.

Siltronic has taken the challenge to the market and manifested again our leading edge in floatzone technology. Powerful numerical simulations allow to visualize the flow of dopant in the melt and thus to optimize the pulling scheme to achieve best possible resisitivity uniformity (especially in wafer center where variation is highest in FZ).