Siltronic, Wacker Chemie AG’s semiconductor division, intends to streamline its 200 mm wafer production capacities. As a result, Siltronic plans to close its production site in Hikari, Japan, by mid-2012. The Munich-based chemical group announced this decision today. Hikari’s production volumes shall be transferred to Siltronic’s existing 200 mm wafer plants in Singapore and Portland (Oregon, USA), optimizing capacity utilization at these sites’ facilities. The planned closure is expected to involve expenses of some EUR 70 million. Thereof, around EUR 45 million will be cash-relevant. These expenses had not been included in WACKER’s most recent earnings forecast for fiscal 2011 which calls for earnings before interest, taxes, depreciation and amortization (EBITDA) at last year’s level. Currently, Siltronic is producing at its Hikari site wafers for the semiconductor industry as well as monocrystalline silicon ingots, employing a staff of some 500. To ensure optimum support of its Japanese customers, Siltronic will continue to employ a local sales force and application engineering in Japan.