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Press releasesPress releases

Dec 08, 2011

WACKER Closes Semiconductor Wafer Production in Japan

Siltronic, Wacker Chemie AG’s semiconductor division, intends to streamline its 200 mm wafer production capacities. As a result, Siltronic plans to close its production site in Hikari, Japan, by mid-2012.

Oct 27, 2011

New Freiberg Site Manager to be Appointed in 2012

Effective January 1, 2012, Dr. Andreas Mühe (41) will assume responsibility of Siltronic AG’s Freiberg site, taking over from his predecessor Gerhard Hagen (62), who will begin his retirement at the same time.

Jul 01, 2011

Siltronic AG Joins imec’s GaN-on-Si Research Program to Develop Technology for Next-Gen Power Semiconductors and LEDs

Siltronic AG and the Belgian nano-electronics research institute imec have concluded an agreement to collaborate on the development of silicon wafers with a gallium nitride layer as partner of imec’s GaN-on-Si industrial affiliation program (IIAP).

May 03, 2011

Siltronic Receives Intel’s Preferred Quality Supplier Award

Siltronic has been recognized to receive Intel Corporation’s Preferred Quality Supplier (PQS) award for their performance in 2010. Along with 15 other companies, Siltronic is recognized for their significant contributions providing Intel with polished and epitaxial silicon wafers, deemed essential to Intel’s success.

Feb 07, 2011

Siltronic successfully completes project to study the starting material for advanced transistor technologies

Siltronic AG, a leading producer of silicon wafers, has successfully completed its SIGMADT research project on silicon-based starting materials for three-dimensional transistors. It was supported for a period of 30 months by a €3 million grant to Siltronic AG from Germany’s Federal Ministry of Education and Research (BMBF).

Sep 27, 2010

At the Forefront: European Research on the Next Generation of 450 mm Semiconductor Wafers

Micro- and nanoelectronic components are manufactured onto silicon semiconductor wafers, the diameter of which has increased from just a few millimeters to 300 mm over the last few decades. With 300 mm wafers now well established, manufacturers around the world are taking the next step toward increasing productivity – making 450 mm wafers.

Aug 06, 2009

Wilhelm Sittenthaler to become President & CEO of Siltronic AG

Dr. Wilhelm Sittenthaler, an Executive Board member of Wacker Chemie AG, is to take over again as President & CEO of Siltronic AG. Sittenthaler will retain his responsibilities on Wacker Chemie AG’s Executive Board.

Jul 15, 2009

Siltronic's Executive Board member Dr. Michael Peterat retires

Dr. Michael Peterat (63) is retiring from the Executive Board of Siltronic AG effective November 1, 2009.

Jul 08, 2009

WACKER optimizes its global production network

Wacker Chemie AG intends to introduce a new site strategy to increase flexibility and further optimize the integrated production network of its Siltronic semiconductor subsidiary. Silicon wafer production is to be concentrated at lead sites according to individual diameters.

Mar 23, 2009

BMBF cooperation project DECISIF starts research on strained silicon

In our jobs as well as in our leisure time. Within the DECISIF project, scientific and industrial cooperation partners want to explore the potential of “strained silicon” in order to manufacture even more powerful and energy-saving devices for laptops, mobile phones and MP3-players.

Dec 09, 2008

Siltronic appoints Klaus Fuchs President & CEO

Dr. Klaus Fuchs has been appointed President & CEO of Siltronic AG effective January 1st, 2009. A resolution of Siltronic’s Supervisory Board to this end has been announced by the Munich-based semiconductor company today.

Sep 18, 2008

140 attendees get informed at Siltronic’s Supplier Day

Some 140 delegates from more than 80 companies worldwide have attended Siltronic’s Supplier Days (September 16, 17) in Burghausen (Germany). For the second time managers of Siltronic exchanged with their key suppliers.

Jun 19, 2008

Siltronic and Samsung start Joint Venture of 300 mm wafers in Singapore

Siltronic Samsung Wafer Pte. Ltd., a joint venture of Samsung Electronics Co. Ltd. and Siltronic AG, today commissioned a new fab in Singapore for the production of 300 mm wafers.

Jun 13, 2007

Siltronic sponsors business-minded high-school students

By contributing a total of 30,000 Euros to this project over three years, Siltronic AG is backing the first business high school in Germany. The school, in Pfarrkirchen, received an award in the “Germany - A Country of Ideas” competition held in 2007.

May 23, 2007

Siltronic Corporation receives EPA’s National Environmental Performance Award

Siltronic Corporation (Portland) is being recognized by the U.S. Environmental Protection Agency’s (EPA) for their outstanding commitment to consistently exceed environmental requirements and continuously improve their overall environmental performance.

Jul 14, 2006

Samsung Electronics and Siltronic to jointly construct 300 mm wafer fab in Singapore

Semiconductor technology leader Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology...

Jul 07, 2006

Gerhard Hagen neuer Werkleiter bei Siltronic Freiberg

Gerhard Hagen (57) ist zum 1. Juli 2006 zum neuen Werkleiter des Siltronic Standortes Freiberg berufen worden.

Jun 30, 2006

Dr. Joachim Manke (56) became Siltronic AG’s new CFO on July 1.

Following positions at Dresdner Bank and the Degussa Group, Dr. Joachim Manke became an executive board member of...

Dec 22, 2005

Siltronic spendet an die TU Bergakademie Freiberg für den Erhalt historischer Bücher

Aus Anlass ihres 10-jährigen Bestehens am Standort Freiberg spendet die Siltronic AG an die TU Bergakademie Freiberg 8.000 Euro für den Erhalt und die Restaurierung mehrerer historischer Schriften aus dem Altbestand der Universitätsbibliothek.

Nov 23, 2005

Siltronic expands 300 mm production in Germany

Wafer manufacturer Siltronic AG, based in Munich, is further expanding its 300 mm wafer production in Germany. The company is to invest a total of approximately EUR 136 million in its production sites at Burghausen in Bavaria and Freiberg in Saxony.

Oct 06, 2005

Siltronic celebrates 20th anniversary of the Hikari site in Japan

This October, the wafer manufacturer Siltronic AG, Munich, celebrates the 20th anniversary of its Hikari-based wholly-owned subsidiary Siltronic Japan Corporation.

May 04, 2005

Siltronic certified to ISO/TS 16949:2002

Siltronic Group's quality management system received certification to the ISO standard TS 16949 end of April.

Apr 13, 2005

Siltronic: 2004 characterized by the extension of the 300 mm capacities

For the Siltronic Group, 2004 was characterized by the extension of the 300 mm capacities. The measures initiated in 2003 showed their first positive effects on costs in all areas.

Nov 18, 2004

Siltronic rüstet sich für abschwächende Halbleiterkonjunktur

Die Siltronic AG, München, bereitet sich auf die erwartete Abschwächung im Halbleitermarkt vor.

Nov 05, 2004

Siltronic stärkt Marktausrichtung auf 300 mm Wafer

Der Waferhersteller Siltronic AG, München, fokussiert mit Wirkung zum 1. Dezember 2004 seine organisatorische Aufstellung noch stärker auf die 300 mm-Wafertechnologie.

Aug 11, 2004

Siltronic: Earnings significantly improved in second quarter of 2004

Munich – In the second quarter of 2004, the wafer manufacturer Siltronic AG (Munich) significantly improved its earnings performance for the second time in a row and thus is in line with the plan for the full year 2004.

Jun 22, 2004

Siltronic Opens New 300 mm Plant in Freiberg

The silicon wafer manufacturer Siltronic AG in Munich has opened a new plant in Freiberg for the production of 300 mm wafers – the technology of the future in the chip industry.

Feb 23, 2004

Siltronic unterzeichnet Lizenzvertrag über Nutzung von Soitecs SMART-CUT™

Siltronic, ein Geschäftsbereich der Wacker-Chemie GmbH und einer der drei weltweit führenden Hersteller von Silicium-Wafern für die Halbleiterindustrie , und Soitec (Euronext, Paris), der führende Hersteller von SOI-Wafern (Silicon on Insulator) und anderen hochentwickelten Substraten, gaben heute bekannt, dass Siltronic einen Lizenzvertrag über die Nutzung von Soitecs patentierter Smart-Cut™-Technologie unterzeichnet hat.

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